Flex & Rigid Flex Manufacturing Capabilities: Substrate Manufacturing

With all of its experience and resources HEI delivers the right solutions. HEI offers High Density Interconnect capabilities:

High density flex and rigid flex substrate manufacturing
16,000 square foot facility in Tempe, AZ
AS9100 Rev B and ISO 9001:2008 – certified – ITAR registered
12” x 18” standard panel array
Multi-layer complex flex, rigid flex and rigid substrates
Wide Range of Materials – FR4, BT, Rogers 4003, Polyimide, and LCP
Core thickness down to 12 micron polyimide film with 12 micron copper
Kuttler cupric etcher producing ine widths and spacing down to 25 microns
Blind/Buried vias – sequential build-up technology
Orbotech Laser Direct Imaging (LDI) – layers imaged direct from CAD data
Via holes down to 50 micron – laser drill
(3) Excellon Cobra CO2/YAG lasers – (2) ESI YAG lasers
Class 10,000 photo clean room
(3) Microcraft Fixtureless flying probe testers
Custom designed thin core transport systems on all conveyorized lines supporting laminate thicknesses down to 12 microns
Quality department and analytical lab including: XRF, AA, wire-bonder and calibrated pull-tester
Set-up to meet demanding performance requirements for high reliability medical implantable, medical imaging, hearing products and high frequency telecom
HEI is an EMS company with both internal inorganic and organic substrate manufacturing capability

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