Flip Chip Assembly, Microelectronic Assembly - Capabilities
Flip chip assembly, RF module assembly, SMT assembly and more from leading EMS provider, HEI, Inc. We have been a provider of Microelectronic solutions since 1968.
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- ISO 9001:2000 – certified
- Lean manufacturing cells
- Manufacturing performed in (2) Class 10,000 clean rooms and (1) Class 100,000 clean room
- Assembly on FR4, BT, Polyimide, Ceramic and Rogers 4003
- Al and Au wire bonding capabilities down to 3-mil pitch
- SMT assembly down to 01005
- Flip chip assembly down 1.5mm square die, 8-mil pitch and 2-mil thick Gaes die
- Provide a total microelectronic packaging solution by optimizing technologies such as: Miniature high-density stacked chip solutions, multi-layer flex/rigid flex or ceramic circuits, multi-chip modules, low-inductance chip interconnects and mixed technology assemblies
- Services include consignment/turnkey microelectronic assembly, design, validation/verification, software development/testing, distribution/fulfillment, depot repair/service and EOL management
- Internal ceramic and flex substrate manufacturing
- Microelectronic design experts in electrical, mechanical, optical, medical, software, process, quality and test
- Electrical design expertise consists of microelectronic packaging solutions, digital design, multi-process systems, analog design, low noise design, DSP, RF design, power supply design, low power and battery applications and PCB layout
- Target assemblies are high reliability microelectronics circuits optimally utilizing the combined technologies of advanced assembly processes and flex/rigid flex substrates
- Current assemblies include implantable/non-implantable medical, high power/high frequency telecom and industrial
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