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Microelectronic Assembly and Packaging – Products

Our microelectronic packaging and assembly plant is AS9100 Rev B and ISO 9001:2008-certified with two Class 10,000 Clean Rooms.  HEI provides microelectronics to top manufacturers in the following categories:


Medical Therapeutic and diagnostic hardware, implantable device electronics, imaging hardware subassemblies, components and subassemblies for use in external and implantable devices.

RF Communications / Broadband Fiber optic communication products and high frequency chip carriers and packaging.

Instrumentation and Controls Sensors, MEMS packaging.

Defense and Aerospace Components and subassemblies, Sensors, MEMS packaging, Fiber optic communication products & high frequency chip carries and packaging.

Microelectronic Assembly and Packaging – Products


Contact HEI today for the best in AS9100 Rev B and ISO 9001:2008-certified Microelectronic Assembly & Packaging.

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