HEI’s internal flexible substrate capabilities offer greater control over design, costs and performance. This enables us to provide a total integrated packaging solution for medical applications including implantable and non-implantable applications, as well as for imaging products.

Facility and Process Capabilities

• 30,000 sq. ft. facility with Class 10,000 photo clean room
• Leading-edge laser direct imaging for fine line widths and spacing below 50 microns
• Laser drilled via holes down to 50 microns including buried and blind vias
• Customer designed thin panel transport system
• Core thickness down to 5-micron copper with 50 micro polyimide substrate materials
• AOI – Automated Optical Inspection
• Electrical test with fixtureless flying probe system

This flex substrate capability allows us to design and manufacture some of the most complex, multi-layer, rigid flex solutions. Combined with state-of-the-art microelectronics assembly, HEI is the single source for complex microelectronics components.