HEI is the leader in the design and applications of microelectronics. We develop high-density flexible substrates and complex, ultra-miniature microcircuit assemblies for medical device and medical imaging applications.

From single-chip packages to multiple partitioned hierarchical designs, we provide a total microelectronic packaging solution by optimizing technologies such as:

• Miniature, high-density, stacked-chip solutions
• Multi-layer flexible and rigid-flex or ceramic circuits
• Multi-chip modules
• Low-inductance chip-interconnects
• Mixed technology assemblies such as flip-chip, wire-bonding and stud bumping