Solutions include:

Chip-on-Laminate

• Chip and wire interconnections
• Flip-chip IC integration
• Multi-layer laminate designs
• Aluminum and gold wire bonding to a variety of metallizations, including gold, silver, aluminum and palladium
• Leading edge SMT-to-die designs

Chip-On-Flex

• Chip and wire interconnections
• Flip-chip IC integration
• Passive component attachment
• X-ray inspection capabilities

BGA/CSP/Flip-Chip

• Flip-chip and chip and wire interconnects
• Ceramic or multiple laminate substrate
• Single or multiple IC package designs
• 0006-.0008” (.15mm-.20mm) die bump pitches
• Outlines as small as .008” (.20 mm) larger than the IC
• Full test and x-ray inspection capabilities